Description
high brightness monitor Embedded Android Panel PC
All series of GM Android all-in-one machines, Android panel PC has high brightness monitor are equipped with RK3288 processor, metal body design, steady and durable, and customized interfaces to meet customer needs. The whole system adopts a laminated process to increase the viewing angle of the product and also prevent dust and humidity. The cover glasses are etched with AG surface treatment to prevent glare。
Optical Bonding
Optical bonding between the touch screen and the LCD module can effectively reduce the refraction of the air, and increase the light transmittance, also the display effect is more clear and transparent.
PC System
CPU | Rk3288 |
Chipset | Cortex-A17 |
Memory | 2GB DDR3 |
Storage | eMMC 8GB |
Network | 10/100/1000M Base-T Gigabit Ethernet |
OS | Android 5.1 |
Wi-Fi | 2.4G Wi-Fi (WLAN 802.11b/g/n) |
Display interface | Single and double LVDS interface;EDP |
Bluetooth | 4.1 |
battery | 3V battery (CR2032) |
Display Characteristics
Design | Open Frame |
Diagonal | 12.1’’ |
Panel | LCD, Anti-glare coating |
Native resolution | 1920(H) ×1080(V) (2.1 megapixels Full HD) |
Aspect ratio | 16:9 |
Brightness | 250 cd/m |
LED Life Time | 30,000 Hour |
Contrast Ratio (Center of the screen) | 3000:1 |
Viewable area W x H | 599.6(W)x388.1 (H) |
Response Time | 18ms |
Viewing zone | horizontal/vertical: 178°/178°, right/left: 89°/89°, up/down: 89°/89° |
Support Color | 16.7M colors |
Touch
Touch technology | projective capacitive |
Touchpoints | 10 |
Touch accuracy | ±2mm |
Surface Treatment | Anti-glare (chemical etching) |
Touch interface | USB |
Supported operating systems | win7 、win10、 Linux 、android |
Through-Glass | 3mm |
Touch scheme | EETI |
Mechanical
Fanless design | yes |
MTBF | 30,000 Hour |
Cable management system | yes |
Operation temperature | 0°C – 50°C |
AngeStorage temperature range | – 20°C – 60°C |
Power Management
Power supply unit | External |
Power supply | DC 12V |
Output power | 36W |
Rated output current | 3A |
Installation Method
VESA | 100mm*100mm Mounted at side |
External Connectors
DC-In | ×1 |
HDMI | ×1 |
USB | ×2 |
Headphone and microphone combo 3.5mm | x1 |
Sim card | x1 |
TF card | x1 |
Wi-Fi | 2.4G Wi-Fi (WLAN 802.11b/g/n) |
Com | ×2 |
Internal Connectors
DC IN | ×1 |
USB | ×4 |
Serial | ×1 |
Speaker | ×1 |
IR&LED | ×1 |
Power Keyer | ×1 |
DEBG | ×1 |
LDVS | ×1 |
UART TTL | ×1 |
KEY | ×1 |
12C Control | ×1 |
GPIO | ×1 |
BL Control | ×1 |
EDP | ×1 |
SPK | ×1 |
MIC | ×1 |
PCI_E | ×1 |
Dimensions / Weight
Product dimensions W x H x D | 634 x 386 x 45mm |
Box dimensions W x H x D | 754 x 486 x 85mm |
Weight (without box) | 9.6kg |
Weight (with box) | 13kg |
Product country origin | China |